TSMC are creating the new WoW... and Wafer on Wafer may introduce a new era of 3D GPUs

TSMC, the manufacturer of GPUs for both Nvidia and future AMD graphics cards, have announced a new wafer-stacking technology which could allow both companies to create massively more powerful graphics cards without increasing the size or density of their silicon.

Prices are getting better so you can finally pick up one of the best graphics cards around.

The TSMC Technology Symposium is going on right now out in Santa Clara, and they’ve unveiled a new technology, called Wafer on Wafer (WoW) which allows them to connect chips together without mounting them laterally on the same interposer, or using the likes of AMD’s Infinity Fabric or Intel’s EMIB designs to allow them to communicate.

from
https://www.pcgamesn.com/nvidia-amd-3d-gpus-tsmc-wafer-on-wafer